| Name in long format: | Through-Silicon Vias for 3D Integration |
|---|---|
| ISBN-10: | 0071785140 |
| ISBN-13: | 9780071785143 |
| Book pages: | 512 |
| Book language: | en |
| Edition: | 1 |
| Binding: | Hardcover |
| Publisher: | McGraw Hill |
| Dimensions: | Height: 9.3 Inches, Length: 6.3 Inches, Weight: 1.4991433816 Pounds, Width: 0.9 Inches |















