Through-Silicon Vias for 3D Integration

Author(s)

Name in long format: Through-Silicon Vias for 3D Integration
ISBN-10: 0071785140
ISBN-13: 9780071785143
Book pages: 512
Book language: en
Edition: 1
Binding: Hardcover
Publisher: McGraw Hill
Dimensions: Height: 9.3 Inches, Length: 6.3 Inches, Weight: 1.4991433816 Pounds, Width: 0.9 Inches

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