Area Array Packaging Processes: for BGA, Flip Chip, and CSP
Author(s)
Gilleo, Ken
Gilleo, Ken
| Name in long format: | Area Array Packaging Processes: for BGA, Flip Chip, and CSP |
|---|---|
| ISBN-10: | 0071428291 |
| ISBN-13: | 9780071428293 |
| Book pages: | 259 |
| Book language: | en |
| Edition: | 1 |
| Binding: | Hardcover |
| Publisher: | McGraw-Hill Professional |
| Dimensions: | Height: 9.4 Inches, Length: 7.3 Inches, Weight: 1.41977696728 Pounds, Width: 0.96 Inches |
