Area Array Packaging Handbook: Manufacturing and Assembly (McGraw-Hill Packaging and Electronics Books)
Author(s)
Gilleo, Ken
Gilleo, Ken
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
| Name in long format: | Area Array Packaging Handbook: Manufacturing and Assembly (McGraw-Hill Packaging and Electronics Books) |
|---|---|
| ISBN-10: | 0071500650 |
| ISBN-13: | 9780071500654 |
| Book pages: | 1000 |
| Book language: | en |
| Edition: | 1 |
| Binding: | Kindle Edition |
| Publisher: | McGraw Hill |
| Dimensions: | Page Fidelity |
