Area Array Packaging Handbook: Manufacturing and Assembly

Author(s)

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)

*Details the pros and cons of each technology with varying applications

*Examines packaging ramifications of high density interconnects (HDI)

Name in long format: Area Array Packaging Handbook: Manufacturing and Assembly
ISBN-10: 0071374930
ISBN-13: 9780071374934
Book pages: 1000
Book language: en
Edition: 1
Binding: Hardcover
Publisher: McGraw-Hill Professional
Dimensions: Height: 9.3 Inches, Length: 7.6 Inches, Weight: 3.84927109452 Pounds, Width: 2.33 Inches

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