Area Array Packaging Handbook: Manufacturing and Assembly
Author(s)
Gilleo,Ken
Gilleo,Ken
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)
*Details the pros and cons of each technology with varying applications
*Examines packaging ramifications of high density interconnects (HDI)
| Name in long format: | Area Array Packaging Handbook: Manufacturing and Assembly |
|---|---|
| ISBN-10: | 0071374930 |
| ISBN-13: | 9780071374934 |
| Book pages: | 1000 |
| Book language: | en |
| Edition: | 1 |
| Binding: | Hardcover |
| Publisher: | McGraw-Hill Professional |
| Dimensions: | Height: 9.3 Inches, Length: 7.6 Inches, Weight: 3.84927109452 Pounds, Width: 2.33 Inches |
