WIRE BONDING IN MICROELECTRONICS, 3/E
Author(s)
Harman, George
Harman, George
Keywords
Wire Bonding (electronic Packaging), Production Control, Electronic Packaging, Reliability, Defects, Semiconductors, Failures
Wire Bonding (electronic Packaging), Production Control, Electronic Packaging, Reliability, Defects, Semiconductors, Failures
| Name in long format: | WIRE BONDING IN MICROELECTRONICS, 3/E |
|---|---|
| ISBN-10: | 0071476237 |
| ISBN-13: | 9780071476232 |
| Book pages: | 446 |
| Book language: | en |
| Edition: | 3 |
| Binding: | Hardcover |
| Publisher: | McGraw-Hill Education |
| Dimensions: | Height: 9.4 Inches, Length: 6.4 Inches, Weight: 1.75487960552 Pounds, Width: 1.17 Inches |
